Circuit assembly with circuit module on supporting circuit board, with housing containing integrated circuit chip and electrically conductive plate, aligned with circuit chip on its underside

摘要

Circuit assembly comprises circuit module (2) in housing (4) on supporting circuit board (1). In housing is fitted integrated circuit chip (6) and electrically conductive plate (8) sandwiched between circuit chip underside and circuit board. Circuit board is fitted with metal surface (18), aligned with circuit chip and coupled to conductive plate, whose minimal dimensions equal maximum surface of circuit chip. Typically conductive plate is part of stamped grid. Independent claims are included for circuit module.