| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer method capable of imparting a pushing force to the whole of both a transfer original substrate and a substrate, to which a transfer is conducted approximately uniformly when both substrates are joined and a substrate; and to provide an electro-optic device and a manufacturing method for electronic equipment. SOLUTION: The transfer method contains a process in which a first adhesive 106a is interposed in a first adhesive region 101 assumed on a second substrate, on which each body to be transferred 102a as objects to be transferred in this case in a plurality of bodies to be transferred 102 must be bonded, between the first substrate 100 containing the bodies 102 and the second substrate 200, to which the bodies 102 are transferred; a second adhesive 106b containing gap materials 104b and 104c is interposed in a second adhesive region excepting the first adhesive region 101 and the first substrate 100 and the second substrate 200 are laminated. The transfer method further contains the process, in which the second adhesive 106b is removed, and a transfer process in which the bodies to be transferred 102a as the objects to be transferred in this case are transferred on the second substrate 200 side from the first substrate 100 by separating the first substrate 100 and the second substrate 200. COPYRIGHT: (C)2005,JPO&NCIPI
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