| 摘要 |
PROBLEM TO BE SOLVED: To enhance a yield by suppressing an exfoliation or the like of an accessary pattern 53 at the time of dicing. SOLUTION: A semiconductor wafer before a dicing comprises a silicon substrate 50 with its surface divided into a element forming region 42 and a scribing line region 43, with a passivation film 55 and a polyimide film 56 covering the element forming region 42, and with the accessary pattern 53 comprising a top layer interconnection layer 52 exposing to the scribing line region 43. And the passivation film 55 and the polyimide film 56 covers a part of the accessary pattern 53. COPYRIGHT: (C)2005,JPO&NCIPI |
