| 摘要 |
A processing chamber component, for example, a removable chamber shield, that has a tendency to expand when exposed to a heat flux, is temperature controlled. The temperature controlled component is particularly useful where exposed to material deposits during processing by PVD, CVD and etching, for example. The component is provided with temperature control properties that avoid high temperatures and temperature gradients as well as large temperature fluctuations. In the case of a chamber shield, the shield may be formed of a base layer typically of a refractory metal such as stainless steel, which has a relatively low thermal conductivity but is mounted in contact with a heat sink, usually at one end thereof such that its other end, which is free, has a tendency to heat and partially cool from processing cycle to processing cycle. The chamber part is provided with a cladding on the base layer of a material of higher thermal conductivity than that of the base layer. The cladding is preferably a Nobel metal, such as gold, silver or copper, but optimally copper, and is applied across at least one side of the base layer and into thermal contact with the heat sink, and extending to the free end of the part. The cladding layer is at least 0.5 millimeters thick, and typically a thickness of about 1 millimeter is sufficient, and is preferably cold sprayed onto the base layer.
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