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发明名称
热传导性复合片
摘要
一种热传导性复合片,系将金属箔(2)黏着固定于附黏着剂之树脂膜(1)的黏着面上,并使得在基础聚合物中添加有热传导性填料之热传导性配合物(3)以薄膜状成形于金属箔(2)表面所得者。将机械强度弱之薄金属箔黏着固定于附黏着剂之树脂膜上之后,将热传导性配合物成形,藉此,可提供一种热传导性复合片,于将发热性电子零件与散热器、导热块做组装后,可轻易地自发热性电子零件将散热器、导热块予以卸除,且可高效率地将发热性电子零件所产生之热传导至散热器、导热块。
申请公布号
TW200522310
申请公布日期
2005.07.01
申请号
TW093131615
申请日期
2004.10.19
申请人
富士高分子工业股份有限公司
发明人
舟桥一;山田俊介
分类号
H01L23/373
主分类号
H01L23/373
代理机构
代理人
林镒珠
主权项
地址
日本
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