发明名称 Semiconductor device method for manufacturing the same, apparatus for forming film, and method for forming high-dielectric-constant film
摘要 A semiconductor device having a gate electrode on a silicon substrate via a gate insulating film is formed by laminating the gate insulating film with a silicon oxide film, formed on the silicon substrate, an Hf silicate film is formed on the silicon oxide film, and a nitrogen-containing Hf silicate film formed on the Hf silicate film, and containing Hf in a peak concentration in a range from one atomic % to thirty atomic %, and nitrogen in a peak concentration in a range from ten atomic % to thirty atomic %.
申请公布号 US2005139937(A1) 申请公布日期 2005.06.30
申请号 US20040811979 申请日期 2004.03.30
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. 发明人 KAMIYAMA SATOSHI;ARIKADO TSUNETOSHI
分类号 H01L21/28;H01L21/314;H01L21/316;H01L29/51;H01L29/78;(IPC1-7):H01L29/76;H01L21/823 主分类号 H01L21/28
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