| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which reduces a heat transmission amount from a heatsink to a case. SOLUTION: A first board 14 is assembled to a case 12. Heat radiation parts 22 are disposed so as to come into contact with a heatsink 18. The heat radiation parts 22 are mounted to a second board 16 which is connected to a first board 14. A second board 16 is pinched so as to adiabatically intervene between the case 12 and the heatsink 18. The first board 14 and the second board 16 contain an assembly guide structure 28 for incorporating the second board 16 in the first board 14 at a predetermined assembly position. The assembly guide structure 28 is constituted by a projection 30 of the first board 14 and a hole 32 of the second board 16. COPYRIGHT: (C)2005,JPO&NCIPI
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