| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method wherein it is hard for a wiring to be disconnected with a high reliability, and also to provide a circuit board on which the semiconductor device with a high connecting reliability is mounted, and an electronic apparatus having the semiconductor device. <P>SOLUTION: A semiconductor device 1 is formed with a plurality of resin layers 3, 5, 6, a plurality of wirings 4 connected electrically to an electrode 9 and a plurality of external terminals 7 connected electrically to the wiring 4, on a semiconductor element 2 having a plurality of electrodes 9. A part or all of the plurality of wirings 4 are formed so as to first extend from a portion connected to the electrode 9 toward a center 10 direction of the semiconductor element 2, and are formed so as to be connected to the external terminals 7 from the center 10 direction of the semiconductor element 2 toward the outside via a bent part 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
