发明名称 Semiconductor device
摘要 A Schottky barrier diode in which a p<SUP>+</SUP>-type semiconductor layer is provided in an n<SUP>-</SUP>-type epitaxial layer can realize lowering the forward voltage VF without considering leak current IR. However, when compared with a normal Schottky barrier diode, the forward voltage VF is generally high. When a Schottky metal layer is suitably selected, although the forward voltage VF can be reduced, there is a limit in further reduction. On the other hand, when the resistivity of the n<SUP>-</SUP>-type semiconductor layer is reduced, although the forward voltage VF can be realized, there is a problem that breakdown voltage is deteriorated. In a semiconductor device of the invention, a second n<SUP>-</SUP>-type semiconductor layer having a low resistivity is laminated on a first n<SUP>-</SUP>-type semiconductor layer capable of securing a specified breakdown voltage. P<SUP>+</SUP>-type semiconductor regions are made to have depths equal to or slightly deeper than the second n<SUP>-</SUP>-type semiconductor layer. By this, in a Schottky barrier diode in which leak current IR can be suppressed by pinch off of a depletion layer, the forward voltage VF can be reduced and the specified breakdown voltage can be secured.
申请公布号 US2005139947(A1) 申请公布日期 2005.06.30
申请号 US20040953073 申请日期 2004.09.30
申请人 SANYO ELECTRIC CO., LTD. 发明人 OKADA TETSUYA;SAITO HIROAKI
分类号 H01L21/329;H01L29/47;H01L29/861;H01L29/872;(IPC1-7):H01L29/861 主分类号 H01L21/329
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