| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To supply a stable power to the circuit inside an IC chip while securing a sufficient space for the circuit inside the IC chip. <P>SOLUTION: A power line 6 is formed in the region created due to size difference between the island 2 of a lead frame 1 and an IC chip 4, and surrounds the periphery of the IC chip 4. A plurality of electrodes 7 are formed outside the power line 6, and, further, a GND line 8 is formed outside the electrodes 7, and surrounds the IC chip 4, the power line 6, and the electrodes 7. The pads 5 of the IC chip 4 and the electrodes 7 are electrically connected by wires 10a, and the electrodes 7 and inner leads 3a are electrically connected by wires 10b. In this way, the power line 6 and the GND line 8 are enlarged in cross section for a reduction in wiring impedance. As the result, a constant potential is available at any points of the power line 6 and the GND line 8, and this achieves a stabilized power supply to the circuit inside the IC chip 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
