SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure to be mounted onto a wiring board and enhancing reliability of mounting onto the wiring board in the semiconductor device formed on a substrate with a thin film thickness, a film-like substrate, and a sheet-like substrate.

SOLUTION: A semiconductor element that is formed on a substrate having insulating properties is bonded with a member with a conductive film formed through a medium having anisotropic conductivity. Since the semiconductor device allows the semiconductor element 100 to be electrically connected with the lateral electrode of an interposer 105, the bonding area to the wiring board is increased. The packaging strength is enhanced, and the bonding state is visually checked.

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