发明名称 |
PRESSURE-SENSITIVE ADHESIVE TAPE FOR DICING SEMICONDUCTOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for dicing a semiconductor wafer in which the generation of mustache-shaped chips is reduced and a problem is not generated in a wafer dicing in a dicing process for the wafer. SOLUTION: One surface of a base-material film is coated with a pressure-sensitive adhesive in the pressure-sensitive adhesive tape for dicing a semiconductor. In the tape, the base-material film is composed of at least two layers, and the melting point of a resin in a layer brought into contact with a pressure-sensitive adhesive layer in the film is 130 to 240°C. In the tape, at least one layer besides the layer brought into contact with the pressure-sensitive adhesive layer is composed of a resin composition consisting of the hydrogen additive of 20 to 400 mass pt. of a styrene-butadiene copolymer to a polypropylene resin of 100 mass pt.. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005174963(A) |
申请公布日期 |
2005.06.30 |
申请号 |
JP20030408248 |
申请日期 |
2003.12.05 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
NOMURA YOSHIHIRO;YABUKI AKIRA;YANO SHOZO |
分类号 |
C09J7/02;H01L21/301;(IPC1-7):H01L21/301 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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