THERMOSETTING RESIN COMPOSITION AND LIGHT-EMITTING DIODE COMPRISING THE SAME AS SEALING AGENT

摘要

PROBLEM TO BE SOLVED: To solve the problems that conventional thermosetting resin compositions are not sufficiently durable as a sealing agent for a light-emitting diode of a large light volume driven by a large electric power or a light-emitting diode of a short wavelength highly active on resins because of antinomy between light resistance and thermal shock resistance. SOLUTION: The thermosetting resin composition comprises as essential ingredients (A) a dicarboxylic or oligocarboxylic acid derivative bearing two or more reactive cyclic ether groups per one reactive unit and no carbon-carbon double bond, and (B) an acid anhydride bearing no carbon-carbon double bond. The light-emitting diode is obtained by sealing a light-emitting element with the thermosetting resin composition. The sealing agent exhibits sufficient durability even in the case that the light-emitting diode has the large light volume driven by the large electric power or gives short wavelength emission that are market requirements in recent years. COPYRIGHT: (C)2005,JPO&NCIPI