发明名称 |
Backside cooling apparatus for modular platforms |
摘要 |
A thermal management apparatus is provided, wherein heat generated by an electronic component coupled to a backside of a carrier substrate may be transferred to an opposite front side of the carrier substrate through a thermal conductor sized to pass through an opening in the carrier substrate.
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申请公布号 |
US2005141200(A1) |
申请公布日期 |
2005.06.30 |
申请号 |
US20030748771 |
申请日期 |
2003.12.29 |
申请人 |
CAMPINI EDOARDO;HANDLEY WILLIAM F.;SUMMERS MARK D. |
发明人 |
CAMPINI EDOARDO;HANDLEY WILLIAM F.;SUMMERS MARK D. |
分类号 |
H01L23/367;H01L23/40;H05K1/02;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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