发明名称 Direct contact power transfer pad and method of making same
摘要 A power transfer pad, having: a non-conductive board having a top and a bottom; a plurality of conductive substrate sections disposed across the top of the non-conductive board; at least one conducting element disposed on each of the conductive substrate sections; a plurality of electrical contacts on the bottom of the non-conductive board, wherein each of the electrical contacts on the bottom of the non-conductive board are in electrical communication with one of the conductive substrate sections on the top of the non-conductive board.
申请公布号 US2005139383(A1) 申请公布日期 2005.06.30
申请号 US20040946379 申请日期 2004.09.20
申请人 MEDCONX, INC. 发明人 KENT HAROLD B.;LEVANTE JAMES J.
分类号 H05K1/11;H05K3/06;H05K3/24;H05K3/28;H05K3/42;(IPC1-7):H01R12/00;G03G13/14;H05K1/03 主分类号 H05K1/11
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