ELECTRONIC DEVICE COOLER, ELECTRONIC DEVICE COOLING METHOD, AND ELECTRONIC DEVICE COOLING CONTROL PROGRAM

摘要

A heat distribution detecting section (178) detects heat distributing condition on the surface of an electronic device (200). An ejection control section (160) specifies a position to be cooled depending on the heat distributing condition detected. A nozzle selecting section (180) selects a cooling nozzle corresponding to that position. An ejection time calculating section (168) calculates cooling medium ejection time and timing of the cooling nozzle. In response to a command from the ejection control section (160), a drive unit (182) drives a nozzle unit (184) to eject a cooling medium toward an electronic device (200).