| 摘要 |
PROBLEM TO BE SOLVED: To provide a lithography system and a device manufacturing method in which a wafer chuck is thermally satisfactorily adjusted. SOLUTION: The lithography system is provided, comprising an illumination system for providing a radiation beam, and a support structure for supporting a pattern forming device. The pattern forming device functions to pattern a sectional face of the radiation beam. Also, the lithography system has a substrate table for holding a substrate, and a projection system for projecting a patterned beam on a target portion of the substrate. The lithography system further has a chuck for supporting a target object and a frame for supporting the chuck over other portion of the lithography system. The chuck is thermally separated from at least the frame. COPYRIGHT: (C)2005,JPO&NCIPI |
