Differential etching technique for plate shaped components e.g. electronic circuit board, comprises using an etching unit with a horizontal or vertical transport system

摘要

A process for differentially etching plate shaped components with laminated metal films on one or both sides, comprises using an etching unit with a horizontal or vertical transport system. The etch rate is reduced over the edge region, so it remains thicker than the rest of the plate. An injector is used to feed gas into the etching fluid.