| 摘要 |
PROBLEM TO BE SOLVED: To provide a device capable of dispensing with joining exposure, in a pattern aligner using a mirror device for performing pattern exposure of chips on a wafer. SOLUTION: In the pattern aligner 100, a mirror device array 1 using a plurality of mirror devices and a wafer stage 9 capable of scanning a wafer 8 for movement are included, a second compact projection optical system 5 is arranged between the mirror device array 1 and a pin hole plate 6, and the mirror device array 1 is arranged at least in two stages in the scanning direction and as an entire mirror device, so as to enter a long rectangular region in the step direction. COPYRIGHT: (C)2005,JPO&NCIPI
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