| 发明名称 |
METAL CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT |
| 摘要 |
According to one mode of the present invention, metal-containing resin particles comprising a resin containing a thermosetting resin at 50 wt % or more and having a rate of moisture absorption from 500 to 14500 ppm, and fine metal particles contained in the resin, is provided. |
| 申请公布号 |
KR20050067052(A) |
申请公布日期 |
2005.06.30 |
| 申请号 |
KR20040111802 |
申请日期 |
2004.12.24 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
YAMAGUCHI NAOKO;AOKI HIDEO;TAKUBO CHIAKI |
| 分类号 |
G03G9/08;B32B3/00;G03G9/087;H01L21/00;H01L21/02;H01L21/027;H01L23/12;H01L23/498;H05K1/09;H05K3/10;H05K3/12;H05K3/24;H05K3/46 |
主分类号 |
G03G9/08 |
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