SUBSTITUTION TYPE ELECTROLESS GOLD PLATING BATH

摘要

A substitution type electroless gold plating bath that can prevent the oxidation of the surface of metal to be gold plated without the use of any reducing agent and can form a gold plating of excellent soldering characteristics. The substitution type electroless gold plating bath comprises a water-soluble gold salt, a conductivity enhancer, a chelating agent of imino diacetic acid structure, a surface oxidation inhibitor constituted of an organic compound having two or more nitrogen atoms in its main chain or ring and, as remainder, a solvent.