发明名称 |
LIGHT EMITTING ASSEMBLY WITH SUPPORT FOR HEAT DISSIPATION |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting assembly which has an effective technology for dissipating heat and for reflecting light from a light emitting element. <P>SOLUTION: The light emitting assembly includes a metal substrate for dissipating heat from an assembly. The metal substrate includes an electric insulating layer or a coating at least on its one surface. A line trace is used for an electric insulating layer using a thin or thick film technology. At least the edge of the line trace includes a metal part on which a lead of a light emitting element is soldered or wire bonded. The metal part is placed adjacent to the light emitting element to conduct heat to a base substrate, and/or reflect light from an element being separated from the substrate. The tarnish of the reflecting metal part is delayed by use of clear finishing. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005175427(A) |
申请公布日期 |
2005.06.30 |
申请号 |
JP20040242669 |
申请日期 |
2004.08.23 |
申请人 |
INTERNATL RESISTIVE CO OF TEXAS LP |
发明人 |
MORRIS THOMAS M |
分类号 |
F21K99/00;F21S8/00;F21S8/10;F21V29/00;F21Y101/02;H01L33/00;H05K1/02;H05K1/05;H05K1/09;H05K1/18;H05K3/28 |
主分类号 |
F21K99/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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