| 摘要 |
PROBLEM TO BE SOLVED: To satisfactorily remove by reduction an oxide of solder powder and prevent any void from being formed upon forming a bump of an electrode of a substrate using only the solder powder. SOLUTION: A via hole in a mask forming substrate 3 set on a stage 21 is filled with the solder powder under vacuum. At this time, the via hole is filled with the solder powder while the powder is mixed by stirring by making use of a mask printing method using a squeegee 22 while irradiating reducing free radical gas. Then, the solder powder is heated under vacuum with an upper heater 31 and a lower heater 32 and is reflowed while irradiating the reducing free radical gas to the filled solder powder. COPYRIGHT: (C)2005,JPO&NCIPI |
