| 发明名称 |
Semiconductor device, method of manufacturing a semiconductor device, electroluminescence device, and method of manufacturing an electroluminescence device |
| 摘要 |
A semiconductor device is provided. The semiconductor device includes an element; a mounting board; and a single film made of a conductive material directly coupling the element with the mounting board.
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| 申请公布号 |
US2005139920(A1) |
申请公布日期 |
2005.06.30 |
| 申请号 |
US20040988418 |
申请日期 |
2004.11.12 |
| 申请人 |
KOEDA HIROSHI |
发明人 |
KOEDA HIROSHI |
| 分类号 |
H01L51/50;G09F9/30;H01L21/00;H01L21/02;H01L21/50;H01L21/52;H01L21/77;H01L23/48;H01L27/01;H01L27/12;H01L27/32;H01L29/78;H01L29/786;H05B33/10;H05B33/14;(IPC1-7):H01L27/01 |
主分类号 |
H01L51/50 |
| 代理机构 |
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代理人 |
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