Polymer removal method for use in manufacturing semiconductor devices

摘要

Polymer removal methods for use in manufacturing semiconductor devices are disclosed. An example polymer removal method places wafers on which metal patterns are formed on a wet station employing a batch spin method. The example method treats the wafers with a chemical while rotating the wafers at a first speed that varies and discharges the chemical and rinses the wafers while rotating the wafers at a second speed greater than the first speed.