SEMICONDUCTOR MODULE HAVING SEMICONDUCTOR CHIP PACKAGE WHICH IS VERTICALLY MOUNTED ON MODULE BOARD

摘要

A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.