| 发明名称 |
Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof |
| 摘要 |
An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; a barrier layer located in the via opening; an interlayer of palladium and/or platinum on the barrier layer; and a layer of copper or copper alloy on the interlayer is provided.
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| 申请公布号 |
US6911229(B2) |
申请公布日期 |
2005.06.28 |
| 申请号 |
US20020215324 |
申请日期 |
2002.08.09 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRICACOS PANAYOTIS C.;BOETTCHER STEVEN H.;MCFEELY FENTON READ;PAUNOVIC MILAN |
| 分类号 |
H01L21/285;H01L21/288;H01L21/768;H01L23/532;(IPC1-7):B05D5/12;H01L21/44;C23C14/32 |
主分类号 |
H01L21/285 |
| 代理机构 |
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代理人 |
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