发明名称 RESIN COMPOSITION HAVING FLAME-RETARDANCY AND MOISTURE RESISTANCE, CIRCUIT BOARD PROTECTED WITH THE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an insulative resin composition having moisture resistance and flame-retardancy containing no halogen. SOLUTION: A composite layer comprising a first resin layer 21 and a second resin layer 22 is formed on the surface of a base board 10 on which a conductor 11 is formed. The first resin layer 21 comprises a thermosetting resin having an ester bond or the like added with an inorganic filler or the like for imparting moisture resistance. The second resin layer 22 comprises a thermosetting resin having an ether bond added with a phosphorus-based flame-retardant for imparting flame-retardancy. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005161778(A) 申请公布日期 2005.06.23
申请号 JP20030406630 申请日期 2003.12.05
申请人 ALPS ELECTRIC CO LTD 发明人 FUDO HEISHIRO;HIBINO IKUO
分类号 B32B27/18;B32B27/00;H05K3/28;(IPC1-7):B32B27/18 主分类号 B32B27/18
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