发明名称 |
RESIN COMPOSITION HAVING FLAME-RETARDANCY AND MOISTURE RESISTANCE, CIRCUIT BOARD PROTECTED WITH THE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide an insulative resin composition having moisture resistance and flame-retardancy containing no halogen. SOLUTION: A composite layer comprising a first resin layer 21 and a second resin layer 22 is formed on the surface of a base board 10 on which a conductor 11 is formed. The first resin layer 21 comprises a thermosetting resin having an ester bond or the like added with an inorganic filler or the like for imparting moisture resistance. The second resin layer 22 comprises a thermosetting resin having an ether bond added with a phosphorus-based flame-retardant for imparting flame-retardancy. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005161778(A) |
申请公布日期 |
2005.06.23 |
申请号 |
JP20030406630 |
申请日期 |
2003.12.05 |
申请人 |
ALPS ELECTRIC CO LTD |
发明人 |
FUDO HEISHIRO;HIBINO IKUO |
分类号 |
B32B27/18;B32B27/00;H05K3/28;(IPC1-7):B32B27/18 |
主分类号 |
B32B27/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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