发明名称 RESIN COMPOSITION AND DECORATIVE BOARD
摘要 PROBLEM TO BE SOLVED: To provide a decorative board without using formaldehyde. SOLUTION: The resin composition is obtained by compounding a vinyl acetate-based polymer with a molecular weight of 2,000-100,000 and a crosslinking agent having more than one allyl groups in the molecule and an organic peroxide. The compounding ratio is 5-100 pts.wt. of the crosslinking agent, 0.1-10 pts.wt. of the organic peroxide to 100 pts.wt. of the vinyl acetate-based polymer. The crosslinking agent is obtained by the addition reaction of a compound having more than one isocyanate groups and an allyl alcohol. The decorative board is obtained by impregnating paper for decorative boards with the resin composition, drying the paper and molding the paper by heat-press molding. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005162799(A) 申请公布日期 2005.06.23
申请号 JP20030400932 申请日期 2003.12.01
申请人 AICA KOGYO CO LTD 发明人 KAEDE KAZUKI;OGINO TOMOYA
分类号 C08L31/04;C08K5/14;(IPC1-7):C08L31/04 主分类号 C08L31/04
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