发明名称 MOLTEN SOLDERING APPARATUS OR MOLTEN SOLDER PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To make it possible, when soldering or solder plating a work for a multiproduct with a small lot, to perform fine-tuned control of an arm to do an operation in a condition best suited to the work, the operation of fast immersing the work to the surface of molten solder or pulling it up from there to release it. SOLUTION: When the assumption is made that one side of a rectangular work virtual frame circumscribed on a work held at the tip of an arm for fast immersing it to the surface of molten solder is A, the side of the work virtual frame opposed to A is B, the fast immersing the work to the surface of the molten solder is "down", and the pulling up the work to release it from the surface of the molten solder is "up", the molten soldering equipment or molten solder plating equipment performs an up-and-down operation of the work in the sequence of (1) A "down", (2) B "down", (3) A "up", and (4) B "up". COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005167170(A) 申请公布日期 2005.06.23
申请号 JP20030436280 申请日期 2003.12.03
申请人 SHOEI BANZU:KK 发明人 TAKANASHI MAKOTO;NAKANO HIROMICHI
分类号 C23C2/00;C23C2/08;C23C2/10;H05K3/34;(IPC1-7):H05K3/34 主分类号 C23C2/00
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