| 摘要 |
PROBLEM TO BE SOLVED: To solve the following problem: a wafer ID prepared in a wafer maker hardly has any lift on the surface of a wafer, so that management by human visual observation is difficult, the wafer ID marked by a laser marker in a semiconductor maker has visibility, and can be used for the wafer management by the human visual observation, but scratches or the like exist in a process such as CMP in which surface irregularity is large. SOLUTION: A method for manufacturing a semiconductor device carries out a semiconductor circuit forming process while reading the wafer ID having no irregularity on the surface of a substrate having been marked by the wafer maker by an automatic reading device. Thereafter, the wafer ID including discrimination information for process management/quality management of the semiconductor maker is marked with visibility excellent irregularity with the laser marker, wafer management by the human visual observation is performed in a probe inspection process by using the wafer ID and an assembling process. COPYRIGHT: (C)2005,JPO&NCIPI
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