| 摘要 |
<P>PROBLEM TO BE SOLVED: To apply uniform polishing work over the whole surface of a base board, while uniformly supplying abrasives to the whole area including a central part of the base board, by enabling continuous work of the base board, when making polishing basically by a CMP method. <P>SOLUTION: This polishing device has: a carrying means for carrying the base board 10; a rotary polishing roller 11 contacting with a working object surface of the base board, a supply means 14 for supplying the abrasive 15 toward the working object surface of the base board; a holding means 16 for holding the abrasive in a peripheral predetermined area of a contact part between the working object surface of the base board and the polishing roller; and a guiding means 13 for guiding the abrasives to the contact part between the polishing roller and the working object surface of the base board. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
