Printed circuit dielectric foil and embedded capacitors

摘要

A dielectric circuit board foil ( 400, 600 ) includes a conductive metal foil layer ( 210, 660 ), a crystallized dielectric oxide layer ( 405, 655 ) disposed adjacent a first surface of the conductive metal foil layer, a lanthanum nickelate layer ( 414, 664 ) disposed on the crystallized dielectric oxide layer, and an electrode layer ( 415, 665 ) that is substantially made of one or more base metals disposed on the lanthanum nickelate layer. The foil ( 400, 600 ) may be adhered to a printed circuit board sub-structure ( 700 ) and used to economically fabricate a plurality of embedded capacitors, including isolated capacitors of large capacitive density (>1000 pf/mm²).