PATTERN-FORMING PROCESS UTILIZING NANOIMPRINT AND APPARATUS FOR PERFORMING SUCH PROCESS

摘要

Disclosed is a pattern-forming process wherein problems involved in heat cycle nanoimprint lithography processes have been solved. Specifically disclosed is a method for forming a pattern in a resist film on a substrate by using a first mold having recessed and projected portions. The method comprises (1) a pressing step wherein the first mold is pressed against the resist film while or after heating the first mold to a certain temperature so that the shapes of the recessed and projected portions of the first mold are transferred to the resist film; (2) a separating step wherein the first mold is separated from the resist film; and (3) an etching step wherein the resist film is etched so that the surface of the substrate is exposed.