发明名称 MANUFACTURING METHOD FOR OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for an optical semiconductor element capable of simply and uniformly sealing the optical semiconductor element with a resin. <P>SOLUTION: The manufacturing method for the optical semiconductor device has (1) a process in which a resin layer is formed on the optical semiconductor element loaded on a conductor, and (2) the process in which the resin layer formed in the process (1) is press-molded. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005167092(A) 申请公布日期 2005.06.23
申请号 JP20030406400 申请日期 2003.12.04
申请人 NITTO DENKO CORP 发明人 SUEHIRO ICHIRO;HOTTA YUJI;SADASE NAOKI;KAMATA TAKU
分类号 H01L23/28;B29C43/14;B29C43/18;B29C59/02;B29C70/68;C08G18/02;C08G18/71;C08G18/76;C08G73/00;H01L21/56;H01L23/29;H01L23/31;H01L33/54;H01L33/56 主分类号 H01L23/28
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