| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate which is excellent in electrical property such as transmission property, corresponds to fining and narrow pitch, realizes insulation film formation method such as an electrodeposition method and reduces a manufacturing cost. SOLUTION: In a core substrate and a multilayer wiring substrate which is formed by laminating a wiring layer and an insulating layer via an insulating layer on one or both surfaces of the core substrate, a core material used for the core substrate is silicon, the resistivity of the silicon is 10Ωcm or more, and further preferably, the resistivity of the silicon is 10Ωcm or more and 50Ωcm or less. COPYRIGHT: (C)2005,JPO&NCIPI |
