<p>Disclosed is a lubricant composition for hot forming which contains 10-40 mass% of a solid lubricant, 5-20 mass% of a water-dispersible synthetic resin, 0.5-5 mass% of an amine salt of an inorganic acid, and 45-80 mass% of water. Such a lubricant composition for hot forming exhibits lubricating properties without being separated or washed away by roll cooling water at temperatures not less than 80˚C, while it does not have water resistance at temperatures less than 40˚C and thus can be easily cleaned away by water.</p>
申请公布号
WO2005056740(A1)
申请公布日期
2005.06.23
申请号
WO2004JP18346
申请日期
2004.12.09
申请人
SUMITOMO METAL INDUSTRIES, LTD.;PALACE CHEMICAL CO., LTD.;SASAKI, KENICHI;IIDA, SUMIO;MORI, SHIZUO;TANAKA, KAZUO