发明名称 LUBRICANT COMPOSITION FOR HOT FORMING
摘要 <p>Disclosed is a lubricant composition for hot forming which contains 10-40 mass% of a solid lubricant, 5-20 mass% of a water-dispersible synthetic resin, 0.5-5 mass% of an amine salt of an inorganic acid, and 45-80 mass% of water. Such a lubricant composition for hot forming exhibits lubricating properties without being separated or washed away by roll cooling water at temperatures not less than 80&ring;C, while it does not have water resistance at temperatures less than 40&ring;C and thus can be easily cleaned away by water.</p>
申请公布号 WO2005056740(A1) 申请公布日期 2005.06.23
申请号 WO2004JP18346 申请日期 2004.12.09
申请人 SUMITOMO METAL INDUSTRIES, LTD.;PALACE CHEMICAL CO., LTD.;SASAKI, KENICHI;IIDA, SUMIO;MORI, SHIZUO;TANAKA, KAZUO 发明人 SASAKI, KENICHI;IIDA, SUMIO;MORI, SHIZUO;TANAKA, KAZUO
分类号 B21B25/04;B21B45/02;C10M173/02;(IPC1-7):C10M173/02 主分类号 B21B25/04
代理机构 代理人
主权项
地址