| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing printed wiring board using copper etchant by which a printed wiring board which is reduced in the occurrence of short circuits between conductor circuits and excellent in circuit formability can be provided by minimizing the variation of circuit widths, and suppressing the residues of copper foil even when the copper foil is of an internal layer conductor circuit subjected to rust-proof treatment, such as the chromate treatment etc. SOLUTION: The method of manufacturing the printed wiring board includes a step of laminating resins with copper foil upon the top and bottom surfaces of an internal layer board in which an internal layer circuit is formed, a step of providing interstatial via holes (IVHs) in the resins with copper foil and forming a plated layer on the copper foil and in the IVHs, and a step of forming a resist except circuit forming places provided on the plated layers. The method also includes a step of forming conductor circuits at the circuit forming spots by electroplating, a step of peeling the resist, and a step of etching off the copper except the portions which become conductor circuits by using the copper etchant containing a sulfuric acid and hydrogen peroxide. COPYRIGHT: (C)2005,JPO&NCIPI |
