| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesion of a first metal electrode surface by impregnating the first metal electrode with a low-melting-point material and to realize large adhesive force when an adhesive layer with insulation property is formed on the first metal electrode. SOLUTION: The manufacturing method of multilayer wiring includes a step where a paste containing a metal frit is baked on a substrate 111 to form a first metal electrode 112, a step to apply a low-melting-point paste 110 containing a glass frit onto the first metal electrode 112, a step to melt the low-melting-point paste 110 and impregnate the first metal electrode 112 with it, a step to form an adhesive layer with insulation property on the smoothened surface of the first metal electrode 112, and a step to form a second metal electrode on the adhesive layer. COPYRIGHT: (C)2005,JPO&NCIPI
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