发明名称 |
COMPOSITION FOR COPPER OXIDE ELECTROLYTIC FORMATION, AND METHOD OF FORMING COPPER OXIDE FILM AND COPPER OXIDE FILM USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To form a copper oxide film with uniform film thickness and composition to a complicated deformed shape with a wet process by a method having satisfactory productivity in a composition for copper oxide electrolytic formation and a method of forming a copper oxide film. SOLUTION: The composition for copper oxide electrolytic formation is composed of an aqueous solution at least comprising an organic acid at least having a carboxyl group and a hydroxyl group, and copper ions. Thus, in a region where the production of precipitates such as copper hydroxide is predicted in an aqueous solution comprising no organic acid, a dissolution region where the precipitations are not produced is present, and copper oxide can be formed by a wet process. COPYRIGHT: (C)2005,JPO&NCIPI
|
申请公布号 |
JP2005163091(A) |
申请公布日期 |
2005.06.23 |
申请号 |
JP20030402311 |
申请日期 |
2003.12.01 |
申请人 |
OSAKA CITY;MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ISAKI MASANOBU;MATSUTANI SHINYA |
分类号 |
C25D9/08;(IPC1-7):C25D9/08 |
主分类号 |
C25D9/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|