| 摘要 |
A bonding pad arrangement for an integrated circuit includes a bonding pad fabricated on a bonding area to enable bonding. A first ESD resistor is fabricated adjacent the bonding area, and at least a second ESD resistor is fabricated adjacent the first ESD resistor and the bonding area. The bonding pad extends beyond the bonding area to connect to the first ESD resistor and to the at least second ESD resistor, thereby providing at least two input ESD circuits for at least one current consuming electronic circuit from the single bonding pad.
|
