| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem wherein a long time is required in the cutting of a molded product after chips respectively mounted on the lattice-like region of a substrate are collectively sealed with a resin, and cutting failure and resin flash caused by the deformation of the substrate occur. <P>SOLUTION: This resin sealing apparatus is equipped with a lower mold 4 on which the substrate 1 having the lattice-like region 2 is placed, the upper mold 5 opposed to the lower mold 4, the whole cavity 22 provided to the upper mold 5 and a filling means for filling the whole cavity 22 with a flowable resin and has partition plates 23 provided to the upper mold 5 so as to partition the whole cavity 22 at the boundaries of the regions 2 in a mold clamped state and a partial cavity 24 comprising respective parts formed by partitioning the whole cavity 22 in a row in a state that the substrate 1 is feld by the partition plates 23. Exposure parts 26 where the substrate 1 is exposed from a sealing resin 15 at the boundaries of the regions 2 are formed to the molded product 16 and the molded product 16 is cut along the imaginary separation lines 17 in the exposure parts 26 by a rotary blade 18 and the width of each of the exposure parts 26 is almost equal to that of the rotary blade 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
