发明名称 THERMOELECTRIC MODULE WITH DIRECTLY BONDED HEAT EXCHANGER
摘要 A thermoelectric device with an improved thermal efficiency has an object to be heated or cooled having a surface, at least one electrically conductive lower pad bonded directly to the surface of the object using a thermally conductive dielectric material, at least one thermoelectric element coupled on one end to the electrically conductive pad, at least one electrically conductive upper pad coupled to an opposite end of the thermoelectric element, and electrical power connections coupled to the device.
申请公布号 WO2005057674(A2) 申请公布日期 2005.06.23
申请号 WO2004US40843 申请日期 2004.12.07
申请人 FERROTEC (USA) CORPORATION;OTEY, ROBERT, W. 发明人 OTEY, ROBERT, W.
分类号 H01L35/30 主分类号 H01L35/30
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