POLISHING HEAD AND POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing head reducing influence on a polishing rate against fluctuation of thickness and pressure of a wafer and a retainer.

SOLUTION: This polishing head is furnished with: a head main body 10 arranged to face against a polishing pad 2; a first recessed part 11 provided on a lower surface of the head main body, a supporting plate 13 free to vertically move which is roughly horizontally provided in the first recessed part; a first film member 16 provided along a head main body inner surface from a supporting plate upper surface and to form a first space 17 on the upper surface side of the supporting plate; a second recessed part 15 provided on a supporting plate lower surface; a second film member 18 provided on the supporting plate lower surface so as to block the second recessed part, forming a second space 19 between itself and the supporting plate and to hold the wafer U; a communicating hole 14 provided on the supporting plate and to communicate the first and second spaces to each other; and a gas supply device provided on the support plate and to press the wafer on the polishing pad by pressurizing the insides of the first and second spaces.

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