WIRING BOARD AND SOLID IMAGE PICK-UP SEMICONDUCTOR DEVICE UTILIZING SAME

摘要

PROBLEM TO BE SOLVED: To provide a miniaturized solid image pick-up semiconductor device with a thin thickness and a wiring board conformable to the device.

SOLUTION: This invention relates to the miniaturized solid image pick-up semiconductor device. This solid image pick-up semiconductor device includes a main body portion where an opening is formed at a predetermined part for packaging a semiconductor chip, and the wiring board configured by a reed or/and a tie bar formed by projecting from an interior surface of the main body to the inside.

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