发明名称 Exposure apparatus, exposure method and semiconductor device production method
摘要 To provide an exposure apparatus, the exposure method and a semiconductor device production method that rise in temperature of a mask by irradiating a charged particle beam can be controlled, displacement of the position of a pattern accompanying with rise in temperature of the mask and the pattern can be projected on an exposed object with a high accuracy. After an electron beam scans on one scan line, scan lines are jumped over number of scan lines and the electron beam scans on the next scan line. Since number of said overjumped lines is set number that can be control rise in temperature of a membrane by overlapping of the electron beam, rise in temperature is controlled by the interlaced-scanning. After once interlaced-scanning, for the scan line, as similar to the above the scan lines are jumped over predetermined number of scan lines and the electron beam scans on the scan lines. By repeating the above interlaced-scan, the set electron beam scans on all the scan lines.
申请公布号 US2005133734(A1) 申请公布日期 2005.06.23
申请号 US20040003968 申请日期 2004.12.03
申请人 SONY CORPORATION 发明人 MORIYA SHIGERU
分类号 G03F7/20;H01J37/147;H01J37/305;H01J37/317;H01L21/027;(IPC1-7):G21G5/00 主分类号 G03F7/20
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