| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which the dispersion of copper into an insulating film can be surely prevented in the case of forming a through via by a wiring material containing copper. SOLUTION: As the constitution of the semiconductor device in which a semiconductor chip 1 is packaged in a package substrate 2 and a via 4 penetrated into the package substrate 2 is formed in the thickness direction of the package substrate 2, the via 4 is formed by the wiring material containing copper, and the insulating film 7 of which the inside and outside are held between a pair of barrier layers 6, 8 is formed around the via 4, so that the dispersion of copper to the insulating film 7 is stopped on both the inside and outside of the insulating film 7. COPYRIGHT: (C)2005,JPO&NCIPI
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