| 摘要 |
PROBLEM TO BE SOLVED: To make a lower wiring layer and an upper wiring layer stably connectable to each other through an isolated pattern in a semiconductor device. SOLUTION: In the semiconductor device, the isolated pattern 6 is arranged on an intermediate layer formed between the lower wiring layer 2 and the upper wiring layer 10, and the lower wiring layer 2 and the isolated pattern 6 are connected to each other through a plurality of contacts C1a-C4a. In addition, the isolated pattern 6 and the upper wiring layer 10 are connected to each other through a plurality of other contacts C1b-C4b. COPYRIGHT: (C)2005,JPO&NCIPI
|
