METHOD FOR PRODUCING SOLDERING GLOBULES ON AN ELECTRICAL COMPONENT

摘要

The invention relates to a method for producing contactings provided in the form of soldering globules (20) on an electrical component comprising a base body (1). To this end, a stencil (5) is placed on the base body and bore holes (10) are made therein while passing through the stencil (5). Fillings (15) are produced by filling the bore holes with an electrically conductive material and by the subsequent hardening thereof. Afterwards, soldering globules (20) are produced directly on the surfaces of the fillings whereby enabling the external electrical contacting of the fillings.