| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conversion mediation for a chip which improves the defect that a known integrated circuit can not be easily converted. <P>SOLUTION: The conversion mediation of a seat body for a chip is composed of a flexible substrate. The substrate has an etched circuit. The upper surface of the substrate has etched a contact to be connected to a plurality of or at least one chip (integrated circuit IC) electrically. The lower surface of the substrate has another etched contact to be connected to a plurality of seat bodies with chip electrically. The circuits on the substrate are respectively connected to the contact of the upper surface of the substrate and the contact of the lower surface. The circuit and two contacts are electrically connected. At the time of using, the substrate is mounted on a mounting base of the seat body for chip and the substrate is connected to the seat body for chip electrically. Consequently, all kinds (or one kind) of chips (integrated circuit IC) can be mounted on the upper surface of the substrate. Any chips can be converted into different chips by the substrate and the seat body for chip at any time. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
